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H-shaped terahertz patch antenna with metamaterials for biomedical applications

International Journal of Electrical and Computer Engineering (IJECE) · Vol. 15 No. 6 (2025)

DOI
10.11591/ijece.v15i6.pp5215-5222
ISSN
2722-2578, 2088-8708
Published
2025-12-01
Publisher
Institute of Advanced Engineering and Science
License
creativecommons.org/licenses/by-sa/4.0

Abstract

This paper presents the design and simulation of an H-shaped terahertz microstrip patch antenna integrated with a metamaterial (MTM) layer to enhance performance for biomedical sensing applications. The antenna modeled using high frequency structure simulator (HFSS), is optimized for 4.37 THz operation. While FR4 is used in simulations for baseline analysis, alternative low-loss substrates such as polyimide or quartz are recommended for practical THz applications. The antenna design uses an FR4 substrate with a dielectric constant of 4.4 and a thickness of 2 μm. Ground plane, feed line, and patch are made of copper material. The integration of the MTM enhance clearly the antenna characteristics. This integration helps to improve the antenna impedance matching; the reflection coefficients was enhanced from -25.01 to -63.10 dB. Additionally, this integration boost also the antenna radiation characteristics, increasing the gain from 2.62 to 3.86 dB and the directivity from 3.57 to 4.97 dB.

Collaboration network of the authors

6 authors · 8 co-authorship links · 3 across different organisations

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  • Université Moulay Ismail de Meknes
  • Université Ibn Zohr
  • Université Ibn-Tofail
  • Affiliation unknown
  • Different organisations
  • Same organisation
  • Affiliation unknown
  • Thicker line = more joint articles · bigger circle = more articles
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Co-authorOrganisationJoint articles
Younes ZouineUniversité Ibn-Tofail2
Seddik BriUniversité Moulay Ismail de Meknes1
Nejwa El MaammarUniversité Moulay Ismail de Meknes1

Affiliations come from OpenAlex; journal OAI-PMH metadata carries none. Authors without an OpenAlex ID are matched by name, which can merge or split people.

This record comes from Crossref (what the publisher deposited), because the journal's own OAI-PMH endpoint could not be harvested.

Metadata source: Crossref API (cadangan, berdasarkan ISSN) https://api.crossref.org/journals/2088-8708/works, first harvested 27 Okt 2026, last seen 27 Okt 2026.
Metadata as oai_dc, converted from Crossref
<oai_dc:dc xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:oai_dc="http://www.openarchives.org/OAI/2.0/oai_dc/"><dc:title>H-shaped terahertz patch antenna with metamaterials for biomedical applications</dc:title><dc:creator>Saidi Alaoui, Kaoutar</dc:creator><dc:creator>Younes, Siraj</dc:creator><dc:creator>Jaouad, Foshi</dc:creator><dc:description>&lt;jats:p&gt;This paper presents the design and simulation of an H-shaped terahertz microstrip patch antenna integrated with a metamaterial (MTM) layer to enhance performance for biomedical sensing applications. The antenna modeled using high frequency structure simulator (HFSS), is optimized for 4.37 THz operation. While FR4 is used in simulations for baseline analysis, alternative low-loss substrates such as polyimide or quartz are recommended for practical THz applications. The antenna design uses an FR4 substrate with a dielectric constant of 4.4 and a thickness of 2 μm. Ground plane, feed line, and patch are made of copper material. The integration of the MTM enhance clearly the antenna characteristics. This integration helps to improve the antenna impedance matching; the reflection coefficients was enhanced from -25.01 to -63.10 dB. Additionally, this integration boost also the antenna radiation characteristics, increasing the gain from 2.62 to 3.86 dB and the directivity from 3.57 to 4.97 dB.&lt;/jats:p&gt;</dc:description><dc:publisher>Institute of Advanced Engineering and Science</dc:publisher><dc:date>2025-12-01</dc:date><dc:type>info:eu-repo/semantics/article</dc:type><dc:format>application/pdf</dc:format><dc:identifier>https://doi.org/10.11591/ijece.v15i6.pp5215-5222</dc:identifier><dc:identifier>10.11591/ijece.v15i6.pp5215-5222</dc:identifier><dc:source>International Journal of Electrical and Computer Engineering (IJECE); Vol 15 No 6 (2025); 5215</dc:source><dc:source>2722-2578</dc:source><dc:source>2088-8708</dc:source><dc:relation>https://ijece.iaescore.com/index.php/IJECE/article/viewFile/38420/18511</dc:relation><dc:rights>http://creativecommons.org/licenses/by-sa/4.0</dc:rights></oai_dc:dc>