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Rotating speed and magnetic pole dependency assisted on copper deposition onto aluminum alloy substrate for bacterial eradication application

Communications in Science and Technology · Vol. 10 No. 1 (2025) · hlm. 17–28

DOI
10.21924/cst.10.1.2025.1547
ISSN
2502-9266, 2502-9258
Terbit
2025-07-31
Penerbit
Komunitas Ilmuwan dan Profesional Muslim Indonesia
Bahasa
eng

Abstrak

Copper (Cu) is widely used in many sectors, such as drinking water piping, heat exchangers, and medical equipment. The present research conducted an electrodeposition of Cu over an aluminum (Al) alloy substrate under the influence of various magnetic poles and rotating speeds. In the present study, a number of investigations, including deposition rate, current efficiency, coating thickness, surface morphology and phase, crystallographic orientation, antibacterial activity, electrochemical behavior, and hardness test were conducted. Increasing the rotation speed promoted to enhanced deposition rate and current efficiency for both magnetic poles influence. An increase in the deposition rate from 12.83 to 13.67 µm/h led to the increasing thickness, a change in surface morphology near the spheroidal, becoming a faceted structure. Presenting and rising in the rotation of a magnetic field led to a reduced surface roughness and crystallite size of Cu film for both magnetic poles influence. The Cu film made without spinning magnetic had a characteristic of highest bacterial inhibition zone around 2.50 ±0.56 cm². The CuRN50 sample had the lowest corrosion rate at around 0.055 mmpy, while the CuRS100 sample had the highest hardness value at approximately 80.72 HV for having the lowest crystallite size. Cu coated onto Al alloy could enhance its properties, such as being antimicrobial, being resistant against corrosion and having the hardness value.

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Rekan penulisOrganisasiArtikel bersama
Bambang SoegijonoAfiliasi tidak diketahui11
Syamsuir SyamsuirAfiliasi tidak diketahui8
Jan SetiawanAfiliasi tidak diketahui5
Silviana SimbolonAfiliasi tidak diketahui4
Hamdan Akbar NotonegoroAfiliasi tidak diketahui4
Ahmad LubiAfiliasi tidak diketahui3
Sajidan SajidanSebelas Maret University2
Muhammad AkhyarSebelas Maret University2
Wiranto WirantoAfiliasi tidak diketahui2
Sugeng PriyantoAfiliasi tidak diketahui2
Danar Hari KrisyonoAfiliasi tidak diketahui2
Fakhrony Sholahudin RohmanAfiliasi tidak diketahui2
Maria Dara Novi HandayaniAfiliasi tidak diketahui1
Hotmaria Agustina PakpahanAfiliasi tidak diketahui1
Ferbian Milas SiswantoAfiliasi tidak diketahui1
Rita DewiAfiliasi tidak diketahui1
Ian PranandiAfiliasi tidak diketahui1
William WilliamAfiliasi tidak diketahui1
Jojor Lamsihar ManaluAfiliasi tidak diketahui1
Ana Lucia EkowatiAfiliasi tidak diketahui1
Yulia Tanti NarwatiAfiliasi tidak diketahui1
Drajat Agus MurdowoNational Research and Innovation Agency1
Yohanes Adhi SatiyokoNational Research and Innovation Agency1
Kustri SumiyardanaNational Research and Innovation Agency1
Nontje Deisye WewengkangNational Research and Innovation Agency1
Sri YonoNational Research and Innovation Agency1
Basori BasoriNational Research and Innovation Agency1
Riski Yulianto SaputraAfiliasi tidak diketahui1
Devi SolehatAfiliasi tidak diketahui1

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Sumber metadata: OAI-PMH (metadata jurnal) https://cst.kipmi.or.id/oai, pertama di-harvest 8 Nov 2026, terakhir terlihat 8 Nov 2026.
Metadata asli (oai_dc) 
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	<dc:title xml:lang="en-US">Rotating speed and magnetic pole dependency assisted on copper deposition onto aluminum alloy substrate for bacterial eradication application</dc:title>
	<dc:creator>Basori, Basori</dc:creator>
	<dc:creator>Ruliyanta </dc:creator>
	<dc:creator>Ajiriyanto, Maman Kartaman </dc:creator>
	<dc:creator>Kriswarini, Rosika </dc:creator>
	<dc:creator>Hardiyanti, Heri </dc:creator>
	<dc:creator>Rosyidan, Cahaya </dc:creator>
	<dc:creator>Yudanto, Sigit Dwi </dc:creator>
	<dc:creator>Situmorang, Evi Ulina Margaretha </dc:creator>
	<dc:creator>Edbert, Daniel </dc:creator>
	<dc:creator>Nanto, Dwi </dc:creator>
	<dc:creator>Susetyo, Ferry Budhi </dc:creator>
	<dc:subject xml:lang="en-US">North and South Pole</dc:subject>
	<dc:subject xml:lang="en-US">SEM-EDS</dc:subject>
	<dc:subject xml:lang="en-US">XRD</dc:subject>
	<dc:subject xml:lang="en-US">electrochemical behavior</dc:subject>
	<dc:subject xml:lang="en-US">hardness</dc:subject>
	<dc:description xml:lang="en-US">Copper (Cu) is widely used in many sectors, such as drinking water piping, heat exchangers, and medical equipment. The present research conducted an electrodeposition of Cu over an aluminum (Al) alloy substrate under the influence of various magnetic poles and rotating speeds. In the present study, a number of investigations, including deposition rate, current efficiency, coating thickness, surface morphology and phase, crystallographic orientation, antibacterial activity, electrochemical behavior, and hardness test were conducted. Increasing the rotation speed promoted to enhanced deposition rate and current efficiency for both magnetic poles influence. An increase in the deposition rate from 12.83 to 13.67 µm/h led to the increasing thickness, a change in surface morphology near the spheroidal, becoming a faceted structure. Presenting and rising in the rotation of a magnetic field led to a reduced surface roughness and crystallite size of Cu film for both magnetic poles influence. The Cu film made without spinning magnetic had a characteristic of highest bacterial inhibition zone around 2.50 ±0.56 cm². The CuRN50 sample had the lowest corrosion rate at around 0.055 mmpy, while the CuRS100 sample had the highest hardness value at approximately 80.72 HV for having the lowest crystallite size. Cu coated onto Al alloy could enhance its properties, such as being antimicrobial, being resistant against corrosion and having the hardness value.</dc:description>
	<dc:publisher xml:lang="en-US">Komunitas Ilmuwan dan Profesional Muslim Indonesia</dc:publisher>
	<dc:date>2025-07-31</dc:date>
	<dc:type>info:eu-repo/semantics/article</dc:type>
	<dc:type>info:eu-repo/semantics/publishedVersion</dc:type>
	<dc:format>application/pdf</dc:format>
	<dc:identifier>https://cst.kipmi.or.id/journal/article/view/1547</dc:identifier>
	<dc:identifier>10.21924/cst.10.1.2025.1547</dc:identifier>
	<dc:source xml:lang="en-US">Communications in Science and Technology; Vol. 10 No. 1 (2025); 17-28</dc:source>
	<dc:source xml:lang="id-ID">Communications in Science and Technology; Vol 10 No 1 (2025); 17-28</dc:source>
	<dc:source>2502-9266</dc:source>
	<dc:source>2502-9258</dc:source>
	<dc:source>10.21924/cst.10.1.2025</dc:source>
	<dc:language>eng</dc:language>
	<dc:relation>https://cst.kipmi.or.id/journal/article/view/1547/205</dc:relation>
	<dc:rights xml:lang="en-US">Copyright (c) 2025 Communications in Science and Technology</dc:rights>
</oai_dc:dc>