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Transient In-Situ Identification of Thermal Parameters in Commercial Thermoelectric Modules using Transfer-Function Models

JURNAL ILMIAH PENDIDIKAN FISIKA AL BIRUNI · Vol. 14 No. 2 (2025) · hlm. 187–201

DOI
10.24042/jipfalbiruni.v14i2.29031
ISSN
2503-023X, 2303-1832
Terbit
2025-12-20
Penerbit
Universitas Islam Negeri Raden Intan Lampung, Indonesia
Bahasa
eng
Lisensi
creativecommons.org/licenses/by-sa/4.0

Abstrak

Thermoelectric devices operate based on the Seebeck and Peltier effects and offer advantages such as high reliability, compact size, lightweight structure, and precise temperature control, making them attractive for electronics, automotive, and aerospace applications. However, accurate in-situ characterization of commercial thermoelectric modules remains challenging due to the limitations of conventional methods, which are often destructive, complex, or costly. This study proposes a novel, non-destructive, and cost-effective transient identification method based on the analysis of thermal response under electrical excitation. The system dynamics were modelled using first- and second-order transfer functions derived from energy conservation principles, enabling parameter estimation from transient temperature data. The proposed approach estimated thermal conductivity (0.747 and 1.129 W/m·K), Seebeck coefficient (35.57 and 21.35 K/A), thermal resistance (3.16 and 1.62 K/W), and thermal capacitance (1.17 and 4.36 J/K). The results demonstrate that the transfer-function-based model effectively captures the thermal dynamics of commercial modules and provides reliable parameter identification. This study contributes a practical in-situ characterization framework that can support thermoelectric performance evaluation and optimization of thermal system design for real-world applications

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Rekan penulisOrganisasiArtikel bersama
Muhammad Syarif HidayatullahLampung University1
Sri Wahyu SuciyatiLampung University1

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Sumber metadata: OAI-PMH (metadata jurnal) http://ejournal.radenintan.ac.id/index.php/al-biruni/oai, pertama di-harvest 9 Nov 2026, terakhir terlihat 9 Nov 2026.
Metadata asli (oai_dc)
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	<dc:title xml:lang="en">Transient In-Situ Identification of Thermal Parameters in Commercial Thermoelectric Modules using Transfer-Function Models</dc:title>
	<dc:creator xml:lang="en">Pauzi, Gurum Ahmad</dc:creator>
	<dc:creator xml:lang="en">Alfiansyah, Irfan </dc:creator>
	<dc:creator xml:lang="en">Riyanto, Agus </dc:creator>
	<dc:creator xml:lang="en">Apriyanto, Donni Kis </dc:creator>
	<dc:creator xml:lang="en">Yulianti, Yanti </dc:creator>
	<dc:creator xml:lang="en">Warsito, Warsito</dc:creator>
	<dc:subject xml:lang="en">Energy efficiency</dc:subject>
	<dc:subject xml:lang="en"> thermoelectric cooling</dc:subject>
	<dc:subject xml:lang="en"> Seebeck effect</dc:subject>
	<dc:subject xml:lang="en">Thermal management </dc:subject>
	<dc:subject xml:lang="en">transient response analysis</dc:subject>
	<dc:description xml:lang="en">Thermoelectric devices operate based on the Seebeck and Peltier effects and offer advantages such as high reliability, compact size, lightweight structure, and precise temperature control, making them attractive for electronics, automotive, and aerospace applications. However, accurate in-situ characterization of commercial thermoelectric modules remains challenging due to the limitations of conventional methods, which are often destructive, complex, or costly. This study proposes a novel, non-destructive, and cost-effective transient identification method based on the analysis of thermal response under electrical excitation. The system dynamics were modelled using first- and second-order transfer functions derived from energy conservation principles, enabling parameter estimation from transient temperature data. The proposed approach estimated thermal conductivity (0.747 and 1.129 W/m·K), Seebeck coefficient (35.57 and 21.35 K/A), thermal resistance (3.16 and 1.62 K/W), and thermal capacitance (1.17 and 4.36 J/K). The results demonstrate that the transfer-function-based model effectively captures the thermal dynamics of commercial modules and provides reliable parameter identification. This study  contributes a practical in-situ characterization framework that can support thermoelectric performance evaluation and optimization of thermal system design for real-world applications</dc:description>
	<dc:publisher xml:lang="en">Universitas Islam Negeri Raden Intan Lampung, Indonesia</dc:publisher>
	<dc:date>2025-12-20</dc:date>
	<dc:type>info:eu-repo/semantics/article</dc:type>
	<dc:type>info:eu-repo/semantics/publishedVersion</dc:type>
	<dc:type xml:lang="en">Peer-reviewed Article</dc:type>
	<dc:format>application/pdf</dc:format>
	<dc:identifier>https://ejournal.radenintan.ac.id/index.php/al-biruni/article/view/29031</dc:identifier>
	<dc:identifier>10.24042/jipfalbiruni.v14i2.29031</dc:identifier>
	<dc:source xml:lang="en">Jurnal Ilmiah Pendidikan Fisika Al-Biruni; Vol. 14 No. 2 (2025): Jurnal Ilmiah Pendidikan Fisika Al-Biruni; 187-201</dc:source>
	<dc:source xml:lang="id">Jurnal Ilmiah Pendidikan Fisika Al-Biruni; Vol 14 No 2 (2025): Jurnal Ilmiah Pendidikan Fisika Al-Biruni; 187-201</dc:source>
	<dc:source>2503-023X</dc:source>
	<dc:source>2303-1832</dc:source>
	<dc:language>eng</dc:language>
	<dc:relation>https://ejournal.radenintan.ac.id/index.php/al-biruni/article/view/29031/10390</dc:relation>
	<dc:rights xml:lang="en">Copyright (c) 2025 Physics Education Department, UIN Raden Intan Lampung, Indonesia</dc:rights>
	<dc:rights xml:lang="en">http://creativecommons.org/licenses/by-sa/4.0</dc:rights>
</oai_dc:dc>