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One-dimensional Lumped-Circuit for Transient Thermal Study of an Induction Electric Motor

International Journal of Electrical and Computer Engineering (IJECE) · Vol. 7 No. 4 (2017)

DOI
10.11591/ijece.v7i4.pp1714-1724
ISSN
2088-8708, 2088-8708
Published
2017-08-01
Publisher
Institute of Advanced Engineering and Science
License
creativecommons.org/licenses/by-nc/4.0

Abstract

Electrical machines lifetime and performances could be improved when along the design process both electromagnetic and thermal behaviors are taken into account. Moreover, real time information about the device thermal state is necessary to an appropriate control with minimized losses. Models based on lumped parameter thermal circuits are: generic, rapid, accurate and qualified as a convenient solution for power systems. The purpose of the present paper is to validate a simulation platform intended for the prediction of the thermal state of an induction motor covering all operation regimes. To do so, in steady state, the proposed model is validated using finite element calculation and experimental records. Then, in an overload situation, obtained temperatures are compared to finite element’s ones. It has been found that, in both regimes, simulation results are with closed proximity to finite element’s ones and experimental records.

Collaboration network of the authors

9 authors · 16 co-authorship links · 8 across different organisations

Hover or tap a name to highlight its co-authors. Double-click to open the author's page.

  • University of Sfax
  • National School of Electronics and Telecommunications of Sfax, Tunisia
  • Laboratoire des systèmes et applications des technologies de l'information et de l'énergie
  • Different organisations
  • Same organisation
  • Affiliation unknown
  • Thicker line = more joint articles · bigger circle = more articles
Show as table
Co-authorOrganisationJoint articles
Moufida KlachUniversity of Sfax1
Rafik NejiUniversity of Sfax1
Mohamed GabsiLaboratoire des systèmes et applications des technologies de l'information et de l'énergie1
Michel LecrivainLaboratoire des systèmes et applications des technologies de l'information et de l'énergie1
Oumaima GarfiUniversity of Sfax1
Nadia ChakerUniversity of Sfax1

Affiliations come from OpenAlex; journal OAI-PMH metadata carries none. Authors without an OpenAlex ID are matched by name, which can merge or split people.

This record comes from Crossref (what the publisher deposited), because the journal's own OAI-PMH endpoint could not be harvested.

Metadata source: Crossref API (cadangan, berdasarkan ISSN) https://api.crossref.org/journals/2088-8708/works, first harvested 27 Okt 2026, last seen 1 Nov 2026.
Metadata as oai_dc, converted from Crossref
<oai_dc:dc xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:oai_dc="http://www.openarchives.org/OAI/2.0/oai_dc/"><dc:title>One-dimensional Lumped-Circuit for Transient Thermal Study of an Induction Electric Motor</dc:title><dc:creator>Jebahi, Radhia</dc:creator><dc:creator>Aloui, Helmi</dc:creator><dc:creator>Ayadi, Moez</dc:creator><dc:description>&lt;jats:p&gt;&amp;lt;span lang="EN-US"&amp;gt;Electrical machines lifetime and performances could be improved when along the design process both electromagnetic and thermal behaviors are taken into account. Moreover, real time information about the device thermal state is necessary to an appropriate control with minimized losses. Models based on lumped parameter thermal circuits are: generic, rapid, accurate and qualified as a convenient solution for power systems. The purpose of the present paper is to validate a simulation platform intended for the prediction of the thermal state of an induction motor covering all operation regimes.  To do so, in steady state, the proposed model is validated using finite element calculation and experimental records. Then, in an overload situation, obtained temperatures are compared to finite element’s ones. It has been found that, in both regimes, simulation results are with closed proximity to finite element’s ones and experimental records.&amp;lt;/span&amp;gt;&lt;/jats:p&gt;</dc:description><dc:publisher>Institute of Advanced Engineering and Science</dc:publisher><dc:date>2017-08-01</dc:date><dc:type>info:eu-repo/semantics/article</dc:type><dc:format>application/pdf</dc:format><dc:identifier>https://doi.org/10.11591/ijece.v7i4.pp1714-1724</dc:identifier><dc:identifier>10.11591/ijece.v7i4.pp1714-1724</dc:identifier><dc:source>International Journal of Electrical and Computer Engineering (IJECE); Vol 7 No 4 (2017); 1714</dc:source><dc:source>2088-8708</dc:source><dc:source>2088-8708</dc:source><dc:relation>http://ijece.iaescore.com/index.php/IJECE/article/viewFile/7709/7195</dc:relation><dc:rights>http://creativecommons.org/licenses/by-nc/4.0</dc:rights></oai_dc:dc>