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Effect of the Thickness of High Tc Superconducting Rectangular Microstrip Patch over Ground Plane with Rectangular Aperture

International Journal of Electrical and Computer Engineering (IJECE) · Vol. 8 No. 3 (2018)

DOI
10.11591/ijece.v8i3.pp1611-1617
ISSN
2088-8708, 2088-8708
Published
2018-06-01
Publisher
Institute of Advanced Engineering and Science
License
creativecommons.org/licenses/by-nc/4.0

Abstract

In recent years, a great interest has been observed in the development and use of new materials in microwave technology. Particularly, a special interest has been observed in the use of superconducting materials in microwave integrated circuits, this is due to their main characteristics. In this paper, the complex resonant frequency problem of a superconductor patch over Ground Plane with Rectangular Aperture is formulated in terms of an integral equation, the kernel of which is the dyadic Green’s function. Galerkin’s procedure is used in the resolution of the electric field integral equation. The surface impedance of the superconductor film is modeled using the two fluids model of Gorter and Casimir. Numerical results concerning the effect of the thickness of the superconductor patch on the characteristics of the antenna are presented.

Collaboration network of the authors

10 authors · 21 co-authorship links · 15 across different organisations

Hover or tap a name to highlight its co-authors. Double-click to open the author's page.

  • University Mohamed Boudiaf of M'sila
  • University Frères Mentouri Constantine 1
  • Mouloud Mammeri University of Tizi-Ouzou
  • University of Batna 2
  • University of Batna 1
  • Abbès Laghrour University of Khenchela
  • Different organisations
  • Same organisation
  • Affiliation unknown
  • Thicker line = more joint articles · bigger circle = more articles
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Co-authorOrganisationJoint articles
Messaoud GarahUniversity Mohamed Boudiaf of M'sila2
Nazih HamdikenUniversity of Batna 12
Ahmed MahamdiUniversity Frères Mentouri Constantine 11
Siham BenkoudaUniversity Frères Mentouri Constantine 11
Sami BedraAbbès Laghrour University of Khenchela1

Affiliations come from OpenAlex; journal OAI-PMH metadata carries none. Authors without an OpenAlex ID are matched by name, which can merge or split people.

This record comes from Crossref (what the publisher deposited), because the journal's own OAI-PMH endpoint could not be harvested.

Metadata source: Crossref API (cadangan, berdasarkan ISSN) https://api.crossref.org/journals/2088-8708/works, first harvested 27 Okt 2026, last seen 27 Okt 2026.
Metadata as oai_dc, converted from Crossref
<oai_dc:dc xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:oai_dc="http://www.openarchives.org/OAI/2.0/oai_dc/"><dc:title>Effect of the Thickness of High Tc Superconducting Rectangular Microstrip Patch over Ground Plane with Rectangular Aperture</dc:title><dc:creator>Boukhennoufa, Nabil</dc:creator><dc:creator>Djouane, Lotfi</dc:creator><dc:creator>Oudira, Houcine</dc:creator><dc:creator>Amir, Mounir</dc:creator><dc:creator>Fortaki, Tarek</dc:creator><dc:description>&lt;jats:p&gt;In recent years, a great interest has been observed in the development and use of new materials in microwave technology. Particularly, a special interest has been observed in the use of superconducting materials in microwave integrated circuits, this is due to their main characteristics. In this paper, the complex resonant frequency problem of a superconductor patch over Ground Plane with Rectangular Aperture is formulated in terms of an integral equation, the kernel of which is the dyadic Green’s function. Galerkin’s procedure is used in the resolution of the electric field integral equation. The surface impedance of the superconductor film is modeled using the two fluids model of Gorter and Casimir. Numerical results concerning the effect of the thickness of the superconductor patch on the characteristics of the antenna are presented.&lt;/jats:p&gt;</dc:description><dc:publisher>Institute of Advanced Engineering and Science</dc:publisher><dc:date>2018-06-01</dc:date><dc:type>info:eu-repo/semantics/article</dc:type><dc:format>application/pdf</dc:format><dc:identifier>https://doi.org/10.11591/ijece.v8i3.pp1611-1617</dc:identifier><dc:identifier>10.11591/ijece.v8i3.pp1611-1617</dc:identifier><dc:source>International Journal of Electrical and Computer Engineering (IJECE); Vol 8 No 3 (2018); 1611</dc:source><dc:source>2088-8708</dc:source><dc:source>2088-8708</dc:source><dc:relation>http://ijece.iaescore.com/index.php/IJECE/article/viewFile/9346/8701</dc:relation><dc:rights>http://creativecommons.org/licenses/by-nc/4.0</dc:rights></oai_dc:dc>