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Metal-embedded SU-8 Slab Techniques for Low-resistance Micromachined Inductors

International Journal of Electrical and Computer Engineering (IJECE) · Vol. 8 No. 6 (2018)

DOI
10.11591/ijece.v8i6.pp4772-4780
ISSN
2088-8708, 2088-8708
Published
2018-12-01
Publisher
Institute of Advanced Engineering and Science
License
creativecommons.org/licenses/by-nc/4.0

Abstract

This work presents a new fabrication technique for micro power inductors by using metal-embedded SU-8 slab molding techniques. The proposed technique uses X-ray lithography to fabricate high-aspect-ratio LIGA-like microstructures in form of embedded structures in the SU-8 slab. This process was applied to fabricate an inductor’s windings with an aspect ratio of 10, which can provide very low resistance but still preserve a small form factor and low profile. Inductors were designed as pot-core structures with overall heights of 370 μm and embedded with 250-μm-thick windings. From the advantage of metal embedded SU-8 slab techniques, 8 μm-thick permalloy core could be fabricated by electroplating around the winding in a single step that could help simplify the process. Four types of inductors were fabricated with 3, 5, 10, and 16 turns in the area of 1.8 to 9.5 mm2. The measured inductance was in the range of 70 nH to 1.3 μH at 1 MHz and DC resistance of 30–336 mΩ for 3–16 turns, respectively. The DC resistance of fabricated inductor was low, as expected, and showed good result compared with the results in literature.

Collaboration network of the authors

7 authors · 12 co-authorship links · 4 across different organisations

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  • Suranaree University of Technology
  • Synchrotron Light Research Institute
  • Affiliation unknown
  • Different organisations
  • Same organisation
  • Affiliation unknown
  • Thicker line = more joint articles · bigger circle = more articles
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Co-authorOrganisationJoint articles
Pittaya DeeklaSuranaree University of Technology1
Rungrueang PhatthanakunSynchrotron Light Research Institute1
Sarawut SujitjornSynchrotron Light Research Institute1

Affiliations come from OpenAlex; journal OAI-PMH metadata carries none. Authors without an OpenAlex ID are matched by name, which can merge or split people.

This record comes from Crossref (what the publisher deposited), because the journal's own OAI-PMH endpoint could not be harvested.

Metadata source: Crossref API (cadangan, berdasarkan ISSN) https://api.crossref.org/journals/2088-8708/works, first harvested 27 Okt 2026, last seen 1 Nov 2026.
Metadata as oai_dc, converted from Crossref
<oai_dc:dc xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:oai_dc="http://www.openarchives.org/OAI/2.0/oai_dc/"><dc:title>Metal-embedded SU-8 Slab Techniques for Low-resistance Micromachined Inductors</dc:title><dc:creator>Mapato, Manot</dc:creator><dc:creator>Klysuban, Prapong</dc:creator><dc:creator>Kulworawanichpong, Thanatchai</dc:creator><dc:creator>Chomnawang, Nimit</dc:creator><dc:description>&lt;jats:p&gt;This work presents a new fabrication technique for micro power inductors by using metal-embedded SU-8 slab molding techniques. The proposed technique uses X-ray lithography to fabricate high-aspect-ratio LIGA-like microstructures in form of embedded structures in the SU-8 slab. This process was applied to fabricate an inductor’s windings with an aspect ratio of 10, which can provide very low resistance but still preserve a small form factor and low profile. Inductors were designed as pot-core structures with overall heights of 370 μm and embedded with 250-μm-thick windings. From the advantage of metal embedded SU-8 slab techniques, 8 μm-thick permalloy core could be fabricated by electroplating around the winding in a single step that could help simplify the process. Four types of inductors were fabricated with 3, 5, 10, and 16 turns in the area of 1.8 to 9.5 mm2. The measured inductance was in the range of 70 nH to 1.3 μH at 1 MHz and DC resistance of 30–336 mΩ for 3–16 turns, respectively. The DC resistance of fabricated inductor was low, as expected, and showed good result compared with the results in literature.&lt;/jats:p&gt;</dc:description><dc:publisher>Institute of Advanced Engineering and Science</dc:publisher><dc:date>2018-12-01</dc:date><dc:type>info:eu-repo/semantics/article</dc:type><dc:format>application/pdf</dc:format><dc:identifier>https://doi.org/10.11591/ijece.v8i6.pp4772-4780</dc:identifier><dc:identifier>10.11591/ijece.v8i6.pp4772-4780</dc:identifier><dc:source>International Journal of Electrical and Computer Engineering (IJECE); Vol 8 No 6 (2018); 4772</dc:source><dc:source>2088-8708</dc:source><dc:source>2088-8708</dc:source><dc:relation>http://ijece.iaescore.com/index.php/IJECE/article/viewFile/6675/11385</dc:relation><dc:rights>http://creativecommons.org/licenses/by-nc/4.0</dc:rights></oai_dc:dc>