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Ohmic Contact characterization Using Image Processing

International Journal of Electrical and Computer Engineering (IJECE) · Vol. 5 No. 6 (2015)

DOI
10.11591/ijece.v5i6.pp1347-1353
ISSN
2088-8708, 2088-8708
Published
2015-12-01
Publisher
Institute of Advanced Engineering and Science
License
creativecommons.org/licenses/by-nc/4.0

Abstract

The Ti/Al/Ni/Au films deposited by electron beam evaporation on n type GaN was demonstrated as a suitable solution for low resistive and thermally stable contact to n-type GaN. The surface morphology of Ti/Al/Ni/Au and Ti/Al contacts were studied as a function of the annealing process conditions using image processing techniques. The algorithm was implemented using the MATLAB software. Using the algorithm made, the area occupied by the pores and porosity in the ohmic contact structures were obtained.

Collaboration network of the authors

2 authors · 1 co-authorship link · 1 across different organisations

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  • Siddaganga Institute of Technology
  • B.M.S. College of Engineering
  • Different organisations
  • Same organisation
  • Affiliation unknown
  • Thicker line = more joint articles · bigger circle = more articles
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Co-authorOrganisationJoint articles

Affiliations come from OpenAlex; journal OAI-PMH metadata carries none. Authors without an OpenAlex ID are matched by name, which can merge or split people.

This record comes from Crossref (what the publisher deposited), because the journal's own OAI-PMH endpoint could not be harvested.

Metadata source: Crossref API (cadangan, berdasarkan ISSN) https://api.crossref.org/journals/2088-8708/works, first harvested 27 Okt 2026, last seen 1 Nov 2026.
Metadata as oai_dc, converted from Crossref
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