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Characterization and modeling the effect of temperature on power HBTs InGaP/GaAs

International Journal of Electrical and Computer Engineering (IJECE) · Vol. 10 No. 1 (2020)

DOI
10.11591/ijece.v10i1.pp581-588
ISSN
2088-8708, 2088-8708
Published
2020-02-01
Publisher
Institute of Advanced Engineering and Science
License
creativecommons.org/licenses/by-nc/4.0

Abstract

The variation and stability of HBT’s parameters at different temperatures are important for utilizing these devices in high-power integrated circuits. The temperature dependence of the DC current gain of bipolar transistors, as a key device parameter, has been extensively investigated. A major issue of the power HBT’s is that the current gain is decreased with junction temperature due to self-heating effect. Hence, how to stabilize the DC current gain and RF performances is important issue to develop the power HBTs. This work describes the DC and high-frequency temperature dependence of InGaP/GaAs HBT’s. The substrate temperature (T) was varied from 25 to 150°C. The static and dynamic performances of the HBT are degraded at high temperature, due to the reduced of carrier mobility with increasing temperature. The current gain (β) decreases at high temperatures; from 140 to 127 at 25 to 150°C, while the decreases in the peak Ft and Fmax are observed from about 110 GHz to 68 GHz and from 165 GHz to 53 GHz respectively in the temperature range of 25 to 150°C.

Collaboration network of the authors

6 authors · 6 co-authorship links

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  • University of Abou Bekr Belkaïd
  • Different organisations
  • Same organisation
  • Affiliation unknown
  • Thicker line = more joint articles · bigger circle = more articles
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Co-authorOrganisationJoint articles
Abderrahmane Zakarya DjennatiUniversity of Abou Bekr Belkaïd1
Nadjat BenadlaUniversity of Abou Bekr Belkaïd1
Khadidja DjeriouatUniversity of Abou Bekr Belkaïd1
Salim KeraiUniversity of Abou Bekr Belkaïd1

Affiliations come from OpenAlex; journal OAI-PMH metadata carries none. Authors without an OpenAlex ID are matched by name, which can merge or split people.

This record comes from Crossref (what the publisher deposited), because the journal's own OAI-PMH endpoint could not be harvested.

Metadata source: Crossref API (cadangan, berdasarkan ISSN) https://api.crossref.org/journals/2088-8708/works, first harvested 27 Okt 2026, last seen 1 Nov 2026.
Metadata as oai_dc, converted from Crossref
<oai_dc:dc xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:oai_dc="http://www.openarchives.org/OAI/2.0/oai_dc/"><dc:title>Characterization and modeling the effect of temperature on power HBTs InGaP/GaAs</dc:title><dc:creator>Nadjet, Mokeddem</dc:creator><dc:creator>Kheireddine, Ghaffour</dc:creator><dc:description>&lt;jats:p&gt;The variation and stability of HBT’s parameters at different temperatures are important for utilizing these devices in high-power integrated circuits. The temperature dependence of the DC current gain of bipolar transistors, as a key device parameter, has been extensively investigated. A major issue of the power HBT’s is that the current gain is decreased with junction temperature due to self-heating effect. Hence, how to stabilize the DC current gain and RF performances is important issue to develop the power HBTs. This work describes the DC and high-frequency temperature dependence of InGaP/GaAs HBT’s. The substrate temperature (T) was varied from 25 to 150°C. The static and dynamic performances of the HBT are degraded at high temperature, due to the reduced of carrier mobility with increasing temperature. The current gain (β) decreases at high temperatures; from 140 to 127 at 25 to 150°C, while the decreases in the peak Ft and Fmax are observed from about 110 GHz to 68 GHz and from 165 GHz to 53 GHz respectively in the temperature range of 25 to 150°C.&lt;/jats:p&gt;</dc:description><dc:publisher>Institute of Advanced Engineering and Science</dc:publisher><dc:date>2020-02-01</dc:date><dc:type>info:eu-repo/semantics/article</dc:type><dc:format>application/pdf</dc:format><dc:identifier>https://doi.org/10.11591/ijece.v10i1.pp581-588</dc:identifier><dc:identifier>10.11591/ijece.v10i1.pp581-588</dc:identifier><dc:source>International Journal of Electrical and Computer Engineering (IJECE); Vol 10 No 1 (2020); 581</dc:source><dc:source>2088-8708</dc:source><dc:source>2088-8708</dc:source><dc:relation>http://ijece.iaescore.com/index.php/IJECE/article/viewFile/16885/pdf</dc:relation><dc:rights>http://creativecommons.org/licenses/by-nc/4.0</dc:rights></oai_dc:dc>