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Long term temperature stability of thermal cycler developed using low profile microprocessor cooler

International Journal of Electrical and Computer Engineering (IJECE) · Vol. 13 No. 1 (2023)

DOI
10.11591/ijece.v13i1.pp278-287
ISSN
2722-2578, 2088-8708
Published
2023-02-01
Publisher
Institute of Advanced Engineering and Science
License
creativecommons.org/licenses/by-sa/4.0

Abstract

Developing a low-cost thermal cycler for a polymerase chain reaction (PCR) is becoming interested in the pandemic era caused by viruses. PCR is the standard gold for the diagnostic. However, in a low-income country, the availability of the device is limited. In this work, the development of a thermal cycler uses electronic modules available in the market. The central part is thermoelectric for heating and cooling, an embedded system to control, and a low-profile cooling fan. The system temperature control used a combination of feedforward, bang-bang, and proportional-integral-derivative (PID) control. The control parameter of the PID was successfully obtained by using Chien servo tuning. The feedforward and bang-bang control are used to optimize the cooling cycle and minimize the rise time. The system shows a well-suited temperature accuracy at the denaturation, annealing, and extension temperature with a temperature deviation of less than 0.5 °C. System performance is maintained even though the system has been running non-stop for 24 hours. The low-profile cooling fan, which is usually used for CPU cooling, shows good results in maintaining temperature stability.

Collaboration network of the authors

8 authors · 16 co-authorship links

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  • University of Brawijaya
  • Different organisations
  • Same organisation
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Co-authorOrganisationJoint articles
Erni YudaningtyasUniversity of Brawijaya1
Muhammad Fauzan Edy PurnomoUniversity of Brawijaya1
Denda DewatamaUniversity of Brawijaya1

Affiliations come from OpenAlex; journal OAI-PMH metadata carries none. Authors without an OpenAlex ID are matched by name, which can merge or split people.

This record comes from Crossref (what the publisher deposited), because the journal's own OAI-PMH endpoint could not be harvested.

Metadata source: Crossref API (cadangan, berdasarkan ISSN) https://api.crossref.org/journals/2088-8708/works, first harvested 27 Okt 2026, last seen 27 Okt 2026.
Metadata as oai_dc, converted from Crossref
<oai_dc:dc xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:oai_dc="http://www.openarchives.org/OAI/2.0/oai_dc/"><dc:title>Long term temperature stability of thermal cycler developed using low profile microprocessor cooler</dc:title><dc:creator>Sakti, Setyawan Purnomo</dc:creator><dc:creator>Triqadafi, Adin Okta</dc:creator><dc:creator>Putra, Aldi Dwi</dc:creator><dc:creator>Putro, Triswantoro</dc:creator><dc:creator>Anggraeni, Dewi</dc:creator><dc:description>&lt;jats:p&gt;&amp;lt;span lang="EN-US"&amp;gt;Developing a low-cost thermal cycler for a polymerase chain reaction (PCR) is becoming interested in the pandemic era caused by viruses. PCR is the standard gold for the diagnostic. However, in a low-income country, the availability of the device is limited. In this work, the development of a thermal cycler uses electronic modules available in the market. The central part is thermoelectric for heating and cooling, an embedded system to control, and a low-profile cooling fan. The system temperature control used a combination of feedforward, bang-bang, and proportional-integral-derivative (PID) control. The control parameter of the PID was successfully obtained by using Chien servo tuning. The feedforward and bang-bang control are used to optimize the cooling cycle and minimize the rise time. The system shows a well-suited temperature accuracy at the denaturation, annealing, and extension temperature with a temperature deviation of less than 0.5 °C. System performance is maintained even though the system has been running non-stop for 24 hours. The low-profile cooling fan, which is usually used for CPU cooling, shows good results in maintaining temperature stability.&amp;lt;/span&amp;gt;&lt;/jats:p&gt;</dc:description><dc:publisher>Institute of Advanced Engineering and Science</dc:publisher><dc:date>2023-02-01</dc:date><dc:type>info:eu-repo/semantics/article</dc:type><dc:format>application/pdf</dc:format><dc:identifier>https://doi.org/10.11591/ijece.v13i1.pp278-287</dc:identifier><dc:identifier>10.11591/ijece.v13i1.pp278-287</dc:identifier><dc:source>International Journal of Electrical and Computer Engineering (IJECE); Vol 13 No 1 (2023); 278</dc:source><dc:source>2722-2578</dc:source><dc:source>2088-8708</dc:source><dc:relation>https://ijece.iaescore.com/index.php/IJECE/article/viewFile/27229/16195</dc:relation><dc:rights>http://creativecommons.org/licenses/by-sa/4.0</dc:rights></oai_dc:dc>