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Multi-label learning by extended multi-tier stacked ensemble method with label correlated feature subset augmentation

International Journal of Electrical and Computer Engineering (IJECE) · Vol. 13 No. 3 (2023)

DOI
10.11591/ijece.v13i3.pp3384-3397
ISSN
2722-2578, 2088-8708
Published
2023-06-01
Publisher
Institute of Advanced Engineering and Science
License
creativecommons.org/licenses/by-sa/4.0

Abstract

Classification is one of the basic and most important operations that can be used in data science and machine learning applications. Multi-label classification is an extension of the multi-class problem where a set of class labels are associated with a particular instance at a time. In a multiclass problem, a single class label is associated with an instance at a time. However, there are many different stacked ensemble methods that have been proposed and because of the complexity associated with the multi-label problems, there is still a lot of scope for improving the prediction accuracy. In this paper, we are proposing the novel extended multi-tier stacked ensemble (EMSTE) method with label correlation by feature subset selection technique and then augmenting those feature subsets while constructing the intermediate dataset for improving the prediction accuracy in the generalization phase of the stacking. The performance effect of the proposed method has been compared with existing methods and showed that our proposed method outperforms the other methods.

Collaboration network of the authors

3 authors · 3 co-authorship links · 2 across different organisations

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  • Siddaganga Institute of Technology
  • Indian Institute of Science Bangalore
  • Different organisations
  • Same organisation
  • Affiliation unknown
  • Thicker line = more joint articles · bigger circle = more articles
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Co-authorOrganisationJoint articles

Affiliations come from OpenAlex; journal OAI-PMH metadata carries none. Authors without an OpenAlex ID are matched by name, which can merge or split people.

This record comes from Crossref (what the publisher deposited), because the journal's own OAI-PMH endpoint could not be harvested.

Metadata source: Crossref API (cadangan, berdasarkan ISSN) https://api.crossref.org/journals/2088-8708/works, first harvested 27 Okt 2026, last seen 27 Okt 2026.
Metadata as oai_dc, converted from Crossref
<oai_dc:dc xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:oai_dc="http://www.openarchives.org/OAI/2.0/oai_dc/"><dc:title>Multi-label learning by extended multi-tier stacked ensemble method with label correlated feature subset augmentation</dc:title><dc:creator>Hemavati, Hemavati</dc:creator><dc:creator>Devi, Visweswariah Susheela</dc:creator><dc:creator>Aparna, Ramalingappa</dc:creator><dc:description>&lt;jats:p&gt;&amp;lt;p&amp;gt;Classification is one of the basic and most important operations that can be used in data science and machine learning applications. Multi-label classification is an extension of the multi-class problem where a set of class labels are associated with a particular instance at a time. In a multiclass problem, a single class label is associated with an instance at a time. However, there are many different stacked ensemble methods that have been proposed and because of the complexity associated with the multi-label problems, there is still a lot of scope for improving the prediction accuracy. In this paper, we are proposing the novel extended multi-tier stacked ensemble (EMSTE) method with label correlation&amp;lt;br /&amp;gt;by feature subset selection technique and then augmenting those feature subsets while constructing the intermediate dataset for improving the prediction accuracy in the generalization phase of the stacking. The performance effect of the proposed method has been compared with existing methods and showed that our proposed method outperforms the other methods.&amp;lt;/p&amp;gt;&lt;/jats:p&gt;</dc:description><dc:publisher>Institute of Advanced Engineering and Science</dc:publisher><dc:date>2023-06-01</dc:date><dc:type>info:eu-repo/semantics/article</dc:type><dc:format>application/pdf</dc:format><dc:identifier>https://doi.org/10.11591/ijece.v13i3.pp3384-3397</dc:identifier><dc:identifier>10.11591/ijece.v13i3.pp3384-3397</dc:identifier><dc:source>International Journal of Electrical and Computer Engineering (IJECE); Vol 13 No 3 (2023); 3384</dc:source><dc:source>2722-2578</dc:source><dc:source>2088-8708</dc:source><dc:relation>https://ijece.iaescore.com/index.php/IJECE/article/viewFile/28167/16587</dc:relation><dc:rights>http://creativecommons.org/licenses/by-sa/4.0</dc:rights></oai_dc:dc>