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Electrical characterization of si nanowire GAA-TFET based on dimensions downscaling

International Journal of Electrical and Computer Engineering (IJECE) · Vol. 11 No. 1 (2021)

DOI
10.11591/ijece.v11i1.pp780-787
ISSN
2722-2578, 2088-8708
Published
2021-02-01
Publisher
Institute of Advanced Engineering and Science
License
creativecommons.org/licenses/by-sa/4.0

Abstract

This research paper explains the effect of the dimensions of Gate-all-around Si nanowire tunneling field effect transistor (GAA Si-NW TFET) on ON/OFF current ratio, drain induces barrier lowering (DIBL), sub-threshold swing (SS), and threshold voltage (VT). These parameters are critical factors of the characteristics of tunnel field effect transistors. The Silvaco TCAD has been used to study the electrical characteristics of Si-NW TFET. Output (gate voltage-drain current) characteristics with channel dimensions were simulated. Results show that 50nm long nanowires with 9nm-18nm diameter and 3nm oxide thickness tend to have the best nanowire tunnel field effect transistor (Si-NW TFET) characteristics.

Collaboration network of the authors

13 authors · 23 co-authorship links · 6 across different organisations

Hover or tap a name to highlight its co-authors. Double-click to open the author's page.

  • Tishk International University
  • Universiti Malaysia Pahang Al-Sultan Abdullah
  • University of Mosul
  • Affiliation unknown
  • Different organisations
  • Same organisation
  • Affiliation unknown
  • Thicker line = more joint articles · bigger circle = more articles
Show as table
Co-authorOrganisationJoint articles
Waheb A. JabbarUniversiti Malaysia Pahang Al-Sultan Abdullah2
Yousif AtallaUniversiti Malaysia Pahang Al-Sultan Abdullah2
Abdul Nasir Abd. GhafarAffiliation unknown2
Ahmed MahmoodUniversiti Malaysia Pahang Al-Sultan Abdullah1
Hadi ManapUniversiti Malaysia Pahang Al-Sultan Abdullah1
Hussein Mohammed AliTishk International University1
Ghadah A. Al-SakkalTishk International University1
Marwa AwniTishk International University1
Abdullah MufeedTishk International University1

Affiliations come from OpenAlex; journal OAI-PMH metadata carries none. Authors without an OpenAlex ID are matched by name, which can merge or split people.

This record comes from Crossref (what the publisher deposited), because the journal's own OAI-PMH endpoint could not be harvested.

Metadata source: Crossref API (cadangan, berdasarkan ISSN) https://api.crossref.org/journals/2088-8708/works, first harvested 27 Okt 2026, last seen 27 Okt 2026.
Metadata as oai_dc, converted from Crossref
<oai_dc:dc xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:oai_dc="http://www.openarchives.org/OAI/2.0/oai_dc/"><dc:title>Electrical characterization of si nanowire GAA-TFET based on dimensions downscaling</dc:title><dc:creator>Abdul-Kadir, Firas Natheer</dc:creator><dc:creator>Hashim, Yasir</dc:creator><dc:creator>Shakib, Muhammad Nazmus</dc:creator><dc:creator>Taha, Faris Hassan</dc:creator><dc:description>&lt;jats:p&gt;This research paper explains the effect of the dimensions of Gate-all-around Si nanowire tunneling field effect transistor (GAA Si-NW TFET) on ON/OFF current ratio, drain induces barrier lowering (DIBL), sub-threshold swing (SS), and threshold voltage (VT). These parameters are critical factors of the characteristics of tunnel field effect transistors. The Silvaco TCAD has been used to study the electrical characteristics of Si-NW TFET. Output (gate voltage-drain current) characteristics with channel dimensions were simulated. Results show that 50nm long nanowires with 9nm-18nm diameter and 3nm oxide thickness tend to have the best nanowire tunnel field effect transistor (Si-NW TFET) characteristics.&lt;/jats:p&gt;</dc:description><dc:publisher>Institute of Advanced Engineering and Science</dc:publisher><dc:date>2021-02-01</dc:date><dc:type>info:eu-repo/semantics/article</dc:type><dc:format>application/pdf</dc:format><dc:identifier>https://doi.org/10.11591/ijece.v11i1.pp780-787</dc:identifier><dc:identifier>10.11591/ijece.v11i1.pp780-787</dc:identifier><dc:source>International Journal of Electrical and Computer Engineering (IJECE); Vol 11 No 1 (2021); 780</dc:source><dc:source>2722-2578</dc:source><dc:source>2088-8708</dc:source><dc:relation>http://ijece.iaescore.com/index.php/IJECE/article/viewFile/23068/14560</dc:relation><dc:rights>http://creativecommons.org/licenses/by-sa/4.0</dc:rights></oai_dc:dc>